TAD-N-PU-2C

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TAD-P-SI-1C Silikonkleber thermisch leitfähig

TAD-N-PU-2C is a thermally conductive two part thixotropic PU-adhesive with thermally conductive fillers in both components. It cures once the two parts come into contact without requiring heat or primer. It has good wetting and high bonding adhesion to most surfaces. The system cures at room temperature or by accelerated heat.
Because of its thixotropic properties, the material can also be used as dispensable 2 part form-in-place gap filler that cures precisely positioned in place. This allows for compensating extreme tolerances and spaces at non-coplanar systems.




PROPRIETÀ

  • Thermal conductivity: 2 W/mK
  • Very high bonding properties
  • Extraordinary chemical resistance and longterm stability
  • Zero stress on components
  • Heat accelerated curing

DISPONIBILITÀ

  • 400 ml (2 x 200 ml) twin cartridges
  • 2 x 1 kg cans
  • 18 l in pails

ESEMPI DI APPLICAZIONE

  • LED systems
  • Processor cooling
  • Memory chip assembly
  • CPU boards
  • EHV battery systems

OVERVIEW

PropertyUnitA-KomponenteB-Komponente
MaterialPolyurethanPolyurethan
ColourBlackWhite
Viscosity @ 5 rpm / 10 rpmPas300 / 284272 / 165
Viscosity (Mixed) @ 5 rpmPas520520
Densityg/cm³2,32,6
Gravity (Mixed)g/cm³2,452,45
HardnessShore D7070
Mixing RatioVolume1:11:1
Tensile Shear Strength (Al)MPa9,59,5
Tensile StrengthMPa14,014,0
Elongation%3030
Shelf Live (@ 25 °C)Months66
Curing Time @ 25 °C< 24 h< 24 h
UL FlammabilityUL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Thermal
Thermal ConductivityW/mK2,02,0
Operating Temperature Range°C- 40 bis + 85- 40 bis + 85
Electric
Dielectric StrengthkV/mm13,513,5
Volume ResistivityOhm - cm4,55 x 10124,55 x 1012