Wherever things get hot – whether in #5G base stations, #automotive applications, #notebooks, #medicaltechnology or #industrialcomputers – you need a reliable #GapFiller that is not only thermally impressive, but also mechanically flexible.

Our TGF-YSP-SI is an electrically insulating silicone gap filler with an extremely high thermal conductivity of 8.0 W/mK. Thanks to its soft, plastic structure, it adapts effortlessly even to large gaps or uneven component geometries – without the need for high pressure. The result: minimum thermal resistance, maximum performance.

Thanks to its natural adhesion, it is easy to pre-apply – whether as a mat, punched part or kiss-cut on sheets. Flexible in application, robust in operation.

Looking for more details? Then check the product site.

Curious now? Let’s talk about how you can get your thermal challenges under control with the TGF-YSP-SI:
+49 7021 73141 79