TGF-IXS-NS is a fantastic electricallyinsulating, thermally conductive and silicone-free gapfiller that enables excellent thermal connections across large gaps – ideal for height differences in electroniccomponents or large tolerances!
Thanks to the special formulation and filling of the material with ceramic powder, TGF-IXS-NS achieves an impressive thermal conductivity of 2 W/mK, while its extreme softness and conformability ensure optimum thermal contact even at minimum pressure. The overall thermal transfer resistance is thus minimized, resulting in efficient heat dissipation. The natural adhesion also facilitates the pre-application of the material.
The applications for TGF-IXS-NS are diverse and range from SMD components and through-holevias to RDRAM memory components and components on heat pipes. Whether in automotive applications, notebooks, medicaltechnology or industrial computers – this material is a real all-rounder when it comes to thermal connections!
So, if you are looking for a reliable solution for your thermal connection requirements, TGF-IXS-NS is the perfect choice!
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