Effective thermalmanagement  is crucial for ensuring the reliability, performance, and longevity of electronic components. Whether in smd technology, automotive, IT, medicaltechnology, or for cooling electronic components such as capacitors and inductioncoils managing heat efficiently is a key challenge — one that requires innovative materials designed for demanding applications.

Our TGF-AXS-SI-GF is a very soft, fiberglass-reinforced silicone gapfiller pad that combines high compression compliance with high thermal conductivity. Thanks to its low hardness, it adapts effortlessly to uneven surfaces, reducing mechanical stress on sensitive components while maintaining optimal heat dissipation. The fiberglass reinforcement enhances tear resistance and stability, making handling easier during assembly and ensuring long-term durability in dynamic environments.

For industries where precision, reliability, and efficiency are essential, this solution provides the ideal balance of flexibility and mechanical strength. Whether you’re working in automotive engineering, designing advanced IT systems, or developing medical technology devices, the TGF-AXS-SI-GF helps you keep temperatures in check without compromising on durability.

Looking for a thermal interface material that meets your high standards? Let’s talk about how we can support your projects!
Contact us for further information or an individual consultation:
+49 7021 73141 79

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