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PRODUCT OF THE MONTH – SEPTEMBER 2026


Large component tolerances and varying stack-up heights can create thermal challenges in modern electronic assemblies. Our TGF-GXS-SI-A1 Silicone Gap Filler is designed to bridge these gaps efficiently while applying only minimal mechanical stress to sensitive components.

  • Electrically insulating & thermally conductive
  • Easy mounting through self tackiness
  • Ultra-soft
  • Ideal for Automotive, Industrial PCs, Medical Technology and Laptops

Its excellent conformability allows it to adapt to uneven surfaces, minimizing thermal resistance and improving long-term reliability of electronic systems. Discover how HALA thermal interface materials help engineers optimize heat dissipation and system performance.
Looking for a flexible gap filler solution to improve your thermal management design? Let’s discuss how TGF-GXS-SI-A1 can support your next project. +49 7021 73141 79

Want to dive deeper? Check it out here:

Explore TGF-GXS-SI-A1

 

Product of the Month September 2026: TGF-GXS-SI-A1, Silicone Gap-Filler, Low volatile siloxane content (LV): ≤ 70 ppm, Thermal conductivity: 1.5 W/mK, Hardness: 20 Shore 00, Operation temperature range: -40 to +150°C

Product of the Month September 2026: TGF-GXS-SI-A1, Silicone Gap-Filler

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+39 335 694 76 31
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