Miniaturisation, 5G and other emerging technologies are increasing the need for better thermal management of sensitive package devices on the boards. Thermal Interface Materials (TIMs) are developing at a rapid pace to meet this need. To discuss this matter, the Global SMT & Packaging Journal has organized a panel of experts – one of them being HALA’s Managing Director Dr. Wilhelm Pohl. He and other professionals discussed options for materials and application technologies.
In case you missed the webinar, you can listen to the recording and even send follow-up questions by registering here
