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TGF-TSS-SI Silikon Gap Filler sehr weich

TGF-TSS-SI is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has a very high thermal conductivity. Through its extraordinary softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly.


  • Extremely soft and compliable
  • Thermal conductivity: 3.2 W/mK
  • Operates at minimum pressure
  • Extraordinary chemical resistance and longterm stability
  • Shock absorbing
  • Easy mounting through self tackiness


  • Sheet 300 x 400 mm
  • Tacky on both sides
  • Die cut parts
  • Kiss cut parts on sheet


Thermal link of:

SMD packages
Through-hole vias
RDRAMs memory modules
Flip Chips, DSPs, BGAs, PPGAs

For use in Automotive applications / Laptops / Medicine engineering / Embedded boards


MaterialCeramic filled siliconeCeramic filled siliconeCeramic filled siliconeCeramic filled siliconeCeramic filled silicone
ColourLight reddish purpleLight reddish purpleLight reddish purpleLight reddish purpleLight reddish purple
HardnessShore 003737373737
UL FlammabilityUL 94V0V0V0V0V0
RoHS Conformity2015 / 863 / EUYesYesYesYesYes
Resistance1 @ 60 PSI @ Thickness°C-inch²/W (mm)0,22 (0,37)0,40 (0,70)0,68 (1,27)0,91 (1,60)1,08 (1,90)
Resistance1 @ 30 PSI @ Thickness°C-inch²/W (mm)0,26 (0,41)0,42 (0,77)0,76 (1,45)1,03 (1,89)1,31 (2,40)
Resistance1 @ 10 PSI @ Thickness°C-inch²/W (mm)0,29 (0,44)0,49 (0,86)0,86 (1,70)1,25 (2,31)1,61 (3,01=
Thermal ConductivityW/mK3,23,23,23,23,2
Operating Temperature Range°C- 60 bis + 180- 60 bis + 180- 60 bis + 180- 60 bis + 180- 60 bis + 180
Dielectric StrengthkV / mm1515151515