TGF-WSS-SI

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TGF-WSS-SI SILIKON GAP-FILLER PADS / WEICH

TGF-WSS-SI is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at very low pressure. By its use the total thermal resistance is minimised. The natural tackiness of the material allows for an easy and reliable pre-assembly.




PROPRIETÀ

  • Very soft and compliable
  • Thermal conductivity: 5.5 W/mK
  • Operates at very low pressure
  • Extraordinary chemical resistance and longterm stability
  • Shock absorbing
  • Easy mounting through self tackiness
  • One or two-side self-tacky

DISPONIBILITÀ

  • Sheet 460 x 100 mm
  • Tacky on both sides
    (TGF-WSSXXXX-SI)
  • Tacky on one side
    (TGF-WSSXXXX-SI-A1)
  • Die cut parts
  • Kiss cut parts on sheet

ESEMPI DI APPLICAZIONE

Thermal link of:

  • SMD packages
  • Through-hole vias
  • RDRAMs memory modules
  • Flip Chips, DSPs, BGAs, PPGAs

For use in Automotive applications / Laptops / Medicine engineering / Embedded boards

OVERVIEW

PropertyUnitTGF-WSS1000-SITGF-WSS2000-SI
MaterialCeramic filled siliconeCeramic filled silicone
ColourGreyGrey
Thicknessmm1,0±0,102,0±0,20
HardnessShore 005555
UL FlammabilityUL 94V0V0
RoHS Conformity2015 / 863 / EUYesYes
Thermal
Resistance1 @ 60 PSI @ Thickness°C-inch²/W (mm)0,30 (0,75)0,41 (1,32)
Resistance1 @ 30 PSI @ Thickness°C-inch²/W (mm)0,32 (0,85)0,49 (1,59)
Resistance1 @ 10 PSI @ Thickness°C-inch²/W (mm)0,36 (0,93)0,56 (1,80)
Thermal ConductivityW/mK5,55,5
Operating Temperature Range°C- 60 bis + 180- 60 bis + 180
Electric
Dielectric StrengthkV / mm1010
Volume ResistivityOhm - cm1,0 x 10131,0 x 1013